Re: What ?
SMIC is mastering process technologies especially in this case to do with multipatterning. The fact that they have to try and conjure techniques to fabricate semiconductors using multi-patterning gives them experience that they can use along with an EUV installation.
Most advanced chips are currently made using both DUV and EUV machines. EUV machines are used for the smallest features only and the wafers are then sent to DUV machines to pattern larger features. ASML is not the only company that makes DUV machines, Nikon, and Canon (of Japan) also make DUV machines, and used to be the major suppliers before ASML.
Many Western commentators view EUV - where ASML is the monopoly supplier, as some kind of Maginot line against China. This is promoted by half-baked media opinions. There are many ways that China can overcome the EUV barrier. It could pursue nano-imprint techniques along with DUV which would enable it to reach 5nm; It could pursue advanced packaging which would make it match the performance of advanced node (5nm, 3nm) chips while still using large feature sizes; finally, it could pursue research on EUV light sources that differentiate away from the laser-produced plasma (LPP) method patented by ASML. It could pursue a discharge-produce plasma method (DPP) or go for an ASML kill shot with a synchrotron approach in the form of an SSMB-EUV.
This latter method Steady State Microbunching (SSMB) could produce smaller features than an ASML machine is capable of without the need for any complex mirroring implementation.