I don't understand point (6) - 3DXP crushes the competition in everything but sequential, but are we going to quibble over 'only' 2GB/s throughput and that could be solved with more channels? Endurance is an order of magnitude higher which is a big deal for write intensive applications, and 3DXP trounces NAND at lower queue depths.
The only problem with 3DXP is it's too expensive to make. Intel is eating a loss with each Optane drive sold and the consumers are already nonplussed about it's current price. If they double the layers as well as double the lateral density as I've heard/read about elsewhere, it'll be a lot more competitive.
Micron has the option to call Intel's share of the Lehi fab in January (meaning Intel has to sell it to them should Micron choose to exercise the option). If Micron does not do so, that will be prophetic of 3DXP's future.
Biting the hand that feeds IT
