"...with 90 per cent of paid customers on the PC version signing on during the last 12 months."
Here in the UK that implies something rather different about their user base!
4 publicly visible posts • joined 3 Aug 2010
You could fit 50x50=2500 20nm features into a μm^2, and 6.25x6.25=3906 16nm features. I make that 56% more, you'd need to drop to 14 to double the density of 20.
If you're assuming that it's a true 3D stack then fair enough (125K v. 244k / μm^3), but that would imply you're reducing the die depth at the same time as feature size.
Is that the case? I'm not a wafer expert.