"...rather than modifying or cutting open the package itself to directly access the silicon."
This is an issue? People cutting through the plastic(?) of the chip itself to get down to the connector pads or even the transistors/circuits on the die? Or am I just misunderstanding? Seems like an awful lot of work that needs an awful lot of very high-precision equipment to pull off without torching the die itself. Probably also requires an agency of three or four letters.
Biting the hand that feeds IT
