Re: A Good Idea
"connections between dies were essentially indistinguishable from on-die connections, imposing no additional delays"
Difficult to achieve. Bond wires have significant inductance at the frequencies we're discussing, which is why DIL chips have widely been replaced by small surface mount packages, and ultimately why we already need ball contact CPUs. So multiple chips gets round the fabrication problems but can degrade speed. It also doesn't help much with dissipation as the entire package is the radiator in most cases.
Biting the hand that feeds IT
