Reply to post: Re: A commendable effort

Fairphone 3 stripped to the modular essentials: Glue? What glue?


Re: A commendable effort

Many very high density parts are now on a BGA footprint and do indeed require specialist equipment to place / replace.

The footprints where you can see the pins can have coplanarity problems for packages with many hundreds of pins (I have seen devices with thousands of pins) (coplanarity issues are where not all the pins are actually at the same seating plane).

BGA sockets are available, but they are expensive and nowhere near as good as soldering to keep all the contacts mated properly quite apart from taking up a lot of space (more than the part being housed usually).

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