Reply to post: Re. difference

Intel offers ingenious piece of 10TB 3D NAND chippery

Conundrum1885 Bronze badge

Re. difference

Well 100 metal layers would be a *lot* more compact than stacked die.

Last time I checked even with thinned wafers the best that could be done (in 2013) was 17 layers in a microSD sized package and this was with optimum packing with all wafers in use.

The newer 64 and 128GB microSDs are just more dense (18nm instead of 22)

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