Reply to post: How is this "3D NAND" any different from stacked dies?

Intel offers ingenious piece of 10TB 3D NAND chippery

Anonymous Coward
Anonymous Coward

How is this "3D NAND" any different from stacked dies?

They've been selling them for years, did they start calling it "3D" once they exceeded 8 dies in a stack? Stupid marketing wins again?

When Samsung announced this I was hoping they were using a large number of process steps to actually create an individual die with that many layers. It would be something crazy like a 100 metal layer chip, but surely that's more efficient than making 32 dies and stacking them? (At least if you work out the wafer handling/processing to allow that many metal layers)

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