How is this "3D NAND" any different from stacked dies?
They've been selling them for years, did they start calling it "3D" once they exceeded 8 dies in a stack? Stupid marketing wins again?
When Samsung announced this I was hoping they were using a large number of process steps to actually create an individual die with that many layers. It would be something crazy like a 100 metal layer chip, but surely that's more efficient than making 32 dies and stacking them? (At least if you work out the wafer handling/processing to allow that many metal layers)