There should 200% tax on BAW 5G chips from Broadcom
As punishment for their extreme greedy, and encourage Apple, Samsung, Xiaomi, etc to move to TDK, Taiyan Yuden, Qualcomm, Qorvo and cut the revenue for Broadcom!
GPUs dominate the conversation when it comes to AI infrastructure. But while they're an essential piece of the puzzle, it's the interconnect fabrics that allow us to harness them to train and run multi-trillion-parameter models at scale. These interconnects span multiple domains, whether it be die-to-die communications on the …
Yeah, that 3.5D XDSiP's the right kind of club sandwich for getting networking integrated in-package, especially with face-to-face HCB that prevents it from tasting like a face-to-back human-centipede or somesuch ...
Take that Gen 3 CPO package (3rd slide) and run some Xscape-style 128+ wavelength lasers through its 16 fibers, and ¡BANG! you get switchless connections to 2,048 devices!
Spread silicon interposer mayo on top of that savory toasted substrate, lay crispy grilled SerDes slices and DPU bacon on that, press-fit the GPU cooked poultry chiplets with thin-sliced CPU tomatoes, close the stack with crispy HBM lettuce, another toast, and repeat the process backwards on top to get that tasty delicious face-to-face flavor! (it's debatable whether I/O cheese should be added too)
It's way better than a 2.5D XPU which is much more of a square pizza by comparison (beforelast slide) and is missing out in the zing department imho (plus too hot for a torrid early summer heatwave!).
Get the 2U trays ready ... and beer for liquid cooling ... me likes!