CHIPS Act funding in question as House Speaker waffles on plan to repeal bill The US CHIPS and Science Act's future may depend on the outcome of Tuesday's Presidential Election after House Speaker Mike Johnson suggested the GOP would likely move to repeal the $280 billion funding bill if the party wins a majority in Congress. "I expect that we probably will, but we haven't developed that part of the …
Do any "pro-business" Republicans understand how long it takes to build a foundry--or any factory--and get it up and running? Not to mention hiring and training a qualified workforce. If it weren't for the CHIPS Act, even if Trump's tariff plan works as advertised and manufacturers started building US plants, they'd be breaking ground in 2026 at the earliest and we'll be lucky to see product before Trump's third term. And minion Mike has already walked it back, saying they'll just get rid of obstacles like environmental reviews before construction, pollution controls on waste water, etc., to make the Act more efficient.
The problem with the CHIP act is it is so loaded down with DEI requirements that it makes it nearly impossible to hire qualified staff. That's why TSMC abandoned plans to build a second foundry in Arizona and instead plans to build one in Japan. It's hard enough to hire qualified people in the US for this industry without being required to hire women and minorities who are vary likely not qualified for the jobs!
Strip out all this useless DEI requirements and this may actually accomplish something!
Don't worry about it! It DOES NOT take much to build a modern foundry these days due to modern multi-head electron-beam etching that can get down to as little as ONE NANOMETRE line trace width values! Once I etch the line traces, I can also DOPE and layer the CMOS substrate (or GaAs or GaN substrates!) using "Confinement Beams" that deposit dopants into a specific area of any given chip design. Since those confinement beams are ALSO MULTI-HEADED within the same structure, I can put a combined etcher/doper machine in a 3D space no larger than two cubic metres, which means I can both etch and dope at the same time on multiple parts of a chip in parallel. A 1000 head electron beam and confinement beam setup lets me create a whole chip in less than a few hours.
I also means, that I can put 1000 etcher/doper machines in a medium sized warehouse and etch/dope a few million 128-bits wide combined-CPU/GPU/DSP/Vector Processor Super-Chips per day that each have a Trillion Transistors on them! It also means I can sell them for $555 USD each and they will have 50 PetaFLOPS sustained using 128-bits wide Floating Point, Fixed Point and Signed/Unsigned Integer calculations!
We can OBLITERATE Intel, AMD, ARM, IBM, Qualcomm, Apple, Samsung, TSMC, Global Foundries, Huaweii, etc. and completely undercut every CPU and RAM chip they make!
NONE of the majors have this technology and YOU the general public is going to get a whiff of it at $555 USD for 50 PetaFLOPS in 1024 cores and 8192 threads with Petabyte-levels of onboard 3D-RAM! Singularity-level A.I. will be on your desktops by next year along with a proper automatic-memory-garbage-collecting 128-bits wide hard-interrupt realtime combined-end-user-selectable Multigridding Server and Workstation operating system to go along with it!
Get Ready! The Far Future is Coming Today!
V
I like the idea of the CHIPS Act but its implementation has been a disaster so far. The only real win for the US has been Micron's new DRAM fabs. DRAM isnt what was critically short at the time, it was logic fab capacity so Im not sure how big a win that is. Most of the rest has gone to non US Companies
$280 billion should have the US up with its own, US owned, leading edge logic fabs and yet not one single dollar has been spent on that
They should have setup a US competitor to TSMC instead of paying TSMC to build fabs in the US, which has so far been a spectacular failure. That US fab could have had Apple, AMD, NVidia, TI, etc as immediate customers and those clients should have been involved in the development process and planning
Apple, AMD, NVidia, TI, etc will be looking for the cheapest options which meet their quality / legal requirements.
That means I doubt they will be lining up to be big customers in a US based fab, unless they are forced to use US based fabs. Maybe US defence industry will use them due to legal requirements. Can't think of many other companies which has that as a requirement.
The government would have setup its own, run by leading government appointed executives and staffed by top government employees.
It would have a monopoly on supply to government organizations.
It could even have a 5 year plan for meeting it's production quota
That sounds like something that would unite all wings of US politics
It is no longer necessary to have billion dollar fabs when $25,000 worth of parts for a 1000-head Electron-Beam etching system and Confinement-Beam Substrate Doping and Layering system that can get down to ONE NANOMETRE line traces can be put into a mere two cubic metres of space and can make an entire CMOS, GaAs or GaN Multi-Trillion Transistor superchip in less than 12 hours (i.e. tape-out-design to direct etching and layering of two of the 128-bits wide combined-CPU/GPU/DSP/Vector processor chips per day)!
A few warehouses full of these 2 cubic metre super-chip making machines could produce a few million of the 128-bits wide 50 PetaFLOP super-chips per day!
Coming soon as a DIY home/office SOC processor fab for YOU!
V
How can someone steal things from you (capabilities) you never had. Well.. by false accusations.
How does one make the receiver of complete voluntarily transferred knowledge (provided by US companies for no other purpose to make larger profits) a criminal ? Well.. by false accusation
Listen this: A Lookback to the Evolution of the PCB Industry with Happy Holden
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