SK hynix begins mass production of 36 GB 12-layer HBM3E

Korea's SK hynix revealed on Thursday that it had become the first chip manufacturer to mass produce 36 GB 12-layer HBM3E chip. The chips are slated to be in the hands of customers by the end of this year. High-bandwidth memory (HBM) chips utilize a stacked design, where layers of DRAM are interconnected with through-silicon …

[Sceptic Tank]

Moulded Underfill

Here in the local language "muf" is the word for "mould" or "mouldy". Just wondering what those chips smell like.

But anyway, that's quite a bit* of RAM there on that chip for what is essentially a completely worthless cause. What's the point of all this computing power you're using it for tasks that produce unreliable output, sometimes very hard to identify? Zero gain activity while boiling the oceans. Get a job! ====> (icon)

* Hehehe, unintended

[Jimmy2Cows]

Re: Moulded Underfill

While I agree with the sentiments about the futility of and pointlessness of current AI, this improvement has the potential to benefit computing in general. It's just that right now the GPU manufacturers are hoovering up all the HBM they get their grubby little paws on.