back to article SK hynix said to be building $4B memory packaging plant in Indiana

High-bandwidth memory (HBM) leader SK hynix is set to build an advanced packaging facility in Indiana, which is estimated to cost $4 billion and come online in 2028 to potentially package high-end HBM. It has been known for some time that SK hynix was interested in building a new facility in Indiana, but the company's board is …

  1. williamyf Bronze badge

    something does not add up

    Normally, fabbing is/can be done in high cost countries because it is highly automated and highly profitable. Meanwhile packaging (even advanced packaging) is more labour intensive and therefore, relegated to low cost counttries. More so if done "at high scale/volumes"

    when done in high cost countries is either as a boutique/R&D initiative, or for historical reasons, and this one seems to be neither.

    so why indiana-USoA and not, say, monterrey-mexico? Only god knows.

    and no, subsidies alone do not explain it.

    only time will tell

    1. Anonymous Coward
      Anonymous Coward

      Re: something does not add up

      -Chips money for fabs

      -Chips money for packaging

      … will there be Chips money for the logistics warehouse to ship it all to China for the final product manufacture too?

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