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back to article Intel shows off backside power and stacked transistors at IEDM

Intel is looking to new options for its future chips including 3D stacking of transistors to enable greater density, extending backside power, and use of gallium nitride for greater power delivery. The Santa Clara chipmaker is showing off some of its research for future silicon at the 69th Annual IEEE International Electron …

  1. Mike 137 Silver badge

    backside power

    Most unfortunate nomenclature. I immediately had visions of methane powered microchips (not at all green).

    But as to the reality, we've been doing this for ages with multilayer PCBs, so it's about time it got used at silicon level.

    1. Anonymous Coward
      Anonymous Coward

      Re: backside power

      I think the term is "power bottom".

    2. Anonymous Coward
      Anonymous Coward

      Re: backside power

      Did they just use the term "backside power" for the proverbial and giggles? I also find myself wondering if there was any brown-nosing required to get the term "backside" on to corporate slides?

  2. Mister Dubious
    Facepalm

    "Intel shows off backside"

    The usual terminology is "moon shot."

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