"In many respects, the chip package is becoming a complete system unto itself. Rather than spreading discrete components like memory controllers, CPUs, and GPUs across a motherboard, they can all be packaged together and communicate over a low-power, high-bandwidth fabric."
Indeed. Historically you got some lumps of stuff and made your own components. Then people started selling ready-made components in a range of sizes - a whole component in a blob of resin - and all you had to do was fix them down and wire them together. Next came the printed circuit board, all ready wired up and ready to stick them on. In due course you just bought your circuit board ready-built and plugged it in. Then came microprocessors - a whole miniature circuit board in a blob of plastic. Anybody remember the Intel Pentium II? CPU and core memory ICs mounted on a PCB as a single plug-in-and-watch-it-fall-out package? It has taken over thirty years of headscratching and failed products to take that forward to the point where we can reliably throw away that PCB and separate modules, and just stick those chips together before encasing in plastic.
I suppose the next thing will be to do away with the LAN and routers and stuff, and plug every system into a single 5G box under the BOFH's desk. We will all interact with it via Metaverse contact lenses welded to our eyeballs. What could possibly go wrong.