back to article TSMC wants to unleash a flood of chiplet designs with 3DFabric Alliance

AMD turned to advanced packaging to create chiplet designs and become a formidable CPU player again. Apple used the tech to beef up the power of its M1 Ultra chip. And Intel is pinning its future success on 2D and 3D multi-die packaging technologies as part of its ambitious comeback plan. Now TSMC, the world's largest contract …

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