And them some
FWIW, the article is heavy on TLAs and FLAs. The MO seems clear.
The CPU is RAMming DPU with IPU confused by the ASIC. The FPGA is unsure where the PCI is and AMD hurds ARMs for NICs on SoCs. The SDN will hug the VM at the OVS to allow CLX connectivity. DDR5 and LPDDR5 are rallying support at the DIMM level to fit the BBVA modelling on the bus.
At what platform temperature where these Hot Chips?