back to article Blistering bandwidth: JEDEC pushes out HBM3 memory specs

The JEDEC Solid State Technology Association has published the official standards for HBM3 memory, the latest update to the High Bandwidth Memory (HBM) Standard. HBM is a high-performance memory type that uses vertically stacked memory chips that are typically mounted on the same substrate close to a CPU or GPU. There are just …

  1. Dwarf Silver badge

    Puzzled

    I’m just left wondering about heat dissipation. How does a stack of 16 chips dissipate since heat generally goes down through the die, then presumably the lower layers in the stack will be hotter than their peers.

    We also know that heat makes memory access times slower, which translates to memory errors as thing heat up.

  2. Pascal Monett Silver badge

    So, DDR is out and HBM is in ?

    That's going to be nice and confusing for the consumer. How does HBM compare to DDR 5 ? Sure, it's new, so it's supposed to be better, but comparing CLs is already a headache, what more do we have to learn now to choose the best RAM for our budget ?

    1. Ropewash

      Re: So, DDR is out and HBM is in ?

      HBM has to be mounted very close to the processor and is usually soldered there, so it's not like you're going to be forced to choose RAM sticks.

      1. Richard 12 Silver badge

        Re: So, DDR is out and HBM is in ?

        Often in-package, so not even soldered.

        You'll primarily see it on GPU accelerator cards, and in some high-performance SoCs most likely aimed at HPC.

        1. Anonymous Coward
          Anonymous Coward

          Re: So, DDR is out and HBM is in ?

          So Macs and iPads then?

          (Since Apple has been putting the RAM in the CPU package anyway)

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