back to article DRAM, it stacks up: SK hynix rolls out 819GB/s HBM3 tech

Korean DRAM fabber SK hynix has developed an HBM3 DRAM chip operating at 819GB/sec. HBM3 (High Bandwidth Memory 3) is a third generation of the HBM architecture which stacks DRAM chips one above another, connects them by vertical current-carrying holes called Through Silicon Vias (TSVs) to a base interposer board, via …

  1. bigtreeman

    stacked ram

    Been there done that.

    We used to stack 8 x 2102PC 1kx1bit rams with the data pin sticking out, birds nest of wires to the data bus.

    Walah!!! 1k byte ram upgrade !!!

    WOW

POST COMMENT House rules

Not a member of The Register? Create a new account here.

  • Enter your comment

  • Add an icon

Anonymous cowards cannot choose their icon

Biting the hand that feeds IT © 1998–2021