Most IC chips
200nm process is perfectly fine for most of applications the only areas that I can think of where they would be suboptimal for maximum performance/minimum power usage would be:
CPU,'s
memory
FLASH
FPGA's
So 200nm would be good for (literally everything else):
Clock/Timing (Clock Generators,PLLs,Frequency Synthesizers,Clock Buffers,Real Time Clocks,)
Data Acquisition (ADC,DAC,Digital Potentiometers)
Interface(USB,I/O Expanders,Signal Buffers,UART's)
Audio/Instrumentation/Video/Buffer Amplifiers,Comparators,Video processing
Logic (Buffers,Counters, FIFO,Gates,Inverters,Multivibrators,Shift Registers, Multiplexers, Level Shifters)
Power Management
LED's
MEMS
And 200nm process and larger is what you need to use for RAD hardened chips for space (outside the earths magnetosphere) to minimise the amount of graded-Z shielding required or to make the part last longer before failure with the same amount of graded-Z shielding. It is a lot like shooting projectiles at threads or tree trunks, both will eventually fail, but one will take slightly longer.