back to article It's cool, claims Samsung as it pushes 3D IC SoC tech at overheated world

Samsung Foundry has begun rollout of its latest 3D IC packaging tech, dubbed “eXtended-Cube” or “X-Cube*", which it claims can result in lower power consumption and faster overall speeds. Like all 3D integrated circuits, X-Cube is built with components stacked on top of each other, creating a single contiguous logical unit. …

  1. tip pc Silver badge

    Immediate trickle down

    > Samsung said its 3D stacked chips will be used in mobile, wearable, AR/VR, and high-performance computing platforms.

    I love the way hitech now days trickles down to consumers pretty much immediately.

    Wouldn’t be this way if it wasn’t for phones constantly pushing the boundaries, you’d have been ridiculed for suggesting that 10 years ago.

    1. Tom Chiverton 1

      Re: Immediate trickle down

      More like the PR dept just tacks on some "now" terms to whatever is the technical change

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