Which major chipperies missing?
"Apple-designed A8 64-bit ARMv8-compatible system-on-chip: it has a couple of billion transistors, is manufactured by TMSC using a 20nm process"
Apple's new iPhones have been torn apart to reveal their innards – and we're told if you're prone to lobbing your new handset at the ground, there's a good chance it's repairable. The chaps at iFixit have given both the 5.5-inch iPhone 6 Plus and 4.7-inch the iPhone 6 seven out of ten in terms of repairability, after tearing …
Interesting, did I read it right? They are using 3 separate chips for the PA's. Qualcomm's gobi PA's have 2g, 3g, HSPA and LTE all on one chip. I would have thought that would better suit apples simplicity approach better, perhaps the power use or unit cost was higher? Are the non qualcomm chips GAAS or CMOS?
Back when there was such a thing as manufacturing in the UK many decades ago, I did a degree in Manufacturing Engineering. One of the courses even back then focused on making kit easier to strip down to access or recycle. With the quality of engineers Apple can employ, I was upset at all these solid blocks of glue they'd make, increasing to waste, and so am actually pleased they've taken a fresh look at this.
It's not going to cost them sales (the point of being a fashion brand over utility brand), and is hopefully just going to mean less pollution when the handsets are crushed and burned for minerals on some Asian backstreet in a decade.
...and at a year old, the "glue" (some variation on double-sided tape by the looks of it) started to come unstuck at the point of maximum stress - the hinge. Before display, backlight, touch screen or aerials failed, I applied epoxy resin adhesive, clamped it shut to set and so far it's holding, fingers crossed.
The laptop is made by S*msung.
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