"a 30Wh cell"
In other words, a battery six times larger than in a HTC Desire (rated 3.7VDC, 1400mAh, 5.18Wh). So definitely aimed at tablets rather than smartphones.
Intel has formally launched Clover Trail, its upcoming Atom system-on-a-chip for Windows 8 tablets. Officially branded the Atom Z2760, Clover Trail contains a dual-core x86 CPU capable of running at up to 1.8GHz in burst mode - maximise the clock frequency as far as the chip's temperature will allow - and equipped with …
Can you elaborate on your "nothing but bad experiences"?
Typing this on a laptop with Intel HD chip (also have an AMD gpu, but rarely gets used), no issues whatsoever here. As an added benefit, gets over 6 hours on battery, half that with the AMD Radeon activated. Runs 3d animation packages perfectly fine, too.
If I may elaborate on Intel graphics core ...
Intel HD graphics are pretty good. Those that they package into the Atom chips, the mobile ones in particular, are garbage. They may look good in demos and on paper but Intel perpetually fails to provide drivers needed to support HW acceleration in a Windows environment. There is ALWAYS something that either doesn't work or works only with outdated APIs.
Let me get this straight - they have managed to achieve the same battery life with their latest 22nm chip that ARMs are managing in 40nm? By my reckoning that still puts them behind ARM on a like-for-like basis by a factor of 4, not to mention that at 22nm Intel will have to use their own, expensive fabs instead of cheap TSMC fabs for mass production.
Great marketing attempt, but not exactly comparable to the competition in sensible terms.
Note this Atom is 32nm (for 22nm Atoms you have to wait until the end of next year), while the latest ARMs use 28nm TSMC - so much for having a process advantage! Note that while Intel may claim to have similar battery life, either video playback (where most of the power goes to the display) or standby are not proof of that. What they would need to show is being able to run benchmarks or do browsing for as long on the same size battery/screen.
Clover Trail is 32 nm, while Bay Trail will be 22 nm. For now, x86 / Intel is going to have to use a smaller die to achieve comparable power usage. I believe CT is 3.5 watts TDP, while BT will be 2 watts TDP. And BT is supposed to do away with the Imagination GPU with an all Intel version. Finally, the video performance in CT is supposed to be quite good, equaling the latest desktop Atom versions. BT should amp things up nicely. The forthcoming Lenovo Thinkpad 2 will use the CT CPU and it should perform admirably as a portable desktop replacement, leaving the heavy lifting for laptops with iCores.
They have achieved the same battery life because of the smaller nm process and a larger battery. You cannot compare the battery life and the nm process between different chip architectures. What food is three weeks of standby time? If your goal is not to use the tablet, then this might be the chip to use. What can the tablet do during standby should be the next question. Is it "asleep" and thus not really doing anything but keeping the OS and app states? Does that 10-hours of video include WiFi or is it a locally stored? X86 is power hungry and there is not much that can be done to change that. ARM is far more efficient as it was designed to be that way, x86 was not. Different tools for different jobs; while you could use a sledgehammer to put in a finishing nail, it is not practical. x86 on a phone or tablet is that sledgehammer in terms of power usage.
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Congrats to Intel for maybe finally catching up in the tablet space four years too late. We are still talking watts instead of milliwatts so the phone space is still some time off. I will say in Intel's defense the x86 architecture is such a POS dog for power consumption that they are working miracles to get even this far. But then again Intel is responsible for foisting x86 on the world not to mention their total fail graphics solutions.
It is all about choice on their terms.
Choose them for your smartphone at your peril.
ARM in full blown Linux is probably what will expand user choice
Apple and MS are happy with cheap ARM and a cheaper bit of Intel for selectively crippled gadgets.
That way they also get to sell real expensive stuff to the lesser victims of fashion.
By now, you likely know the story: Intel made major manufacturing missteps over the past several years, giving rivals like AMD a major advantage, and now the x86 giant is in the midst of an ambitious five-year plan to regain its chip-making mojo.
This week, Intel is expected to detail just how it's going to make chips in the near future that are faster, less costly and more reliable from a manufacturing standpoint at the 2022 IEEE Symposium on VLSI Technology and Circuits, which begins on Monday. The Register and other media outlets were given a sneak peek in a briefing last week.
The details surround Intel 4, the manufacturing node previously known as the chipmaker's 7nm process. Intel plans to use the node for products entering the market next year, which includes the compute tiles for the Meteor Lake CPUs for PCs and the Granite Rapids server chips.
While Intel has bagged Nvidia as a marquee customer for its next-generation Xeon Scalable processor, the x86 giant has admitted that a broader rollout of the server chip has been delayed to later this year.
Sandra Rivera, Intel's datacenter boss, confirmed the delay of the Xeon processor, code-named Sapphire Rapids, in a Tuesday panel discussion at the BofA Securities 2022 Global Technology Conference. Earlier that day at the same event, Nvidia's CEO disclosed that the GPU giant would use Sapphire Rapids, and not AMD's upcoming Genoa chip, for its flagship DGX H100 system, a reversal from its last-generation machine.
Intel has been hyping up Sapphire Rapids as a next-generation Xeon CPU that will help the chipmaker become more competitive after falling behind AMD in technology over the past few years. In fact, Intel hopes it will beat AMD's next-generation Epyc chip, Genoa, to the market with industry-first support for new technologies such as DDR5, PCIe Gen 5 and Compute Express Link.
RSA Conference Intel has released a reference design for a plug-in security card aimed at delivering improved network and security processing without requiring the additional rackspace a discrete appliance would need.
The NetSec Accelerator Reference Design [PDF] is effectively a fully functional x86 compute node delivered as a PCIe card that can be fitted into an existing server. It combines an Intel Atom processor, Intel Ethernet E810 network interface, and up to 32GB of memory to offload network security functions.
According to Intel, the new reference design is intended to enable a secure access service edge (SASE) model, a combination of software-defined security and wide-area network (WAN) functions implemented as a cloud-native service.
After a few years of teasing Ponte Vecchio – the powerful GPU that will go into what will become one of the fastest supercomputers in the world – Intel is sharing more details of the high-performance computing chips that will follow, and one of them will combine CPUs and GPUs in one package.
The semiconductor giant shared the details Tuesday in a roadmap update for its HPC-focused products at the International Supercomputing Conference in Hamburg, Germany.
Intel has only recently carved out a separate group of products for HPC applications because it is now developing versions of Xeon Scalable CPUs, starting with a high-bandwidth-memory (HBM) variant of the forthcoming Sapphire Rapids chips, for high-performance kit. This chip will sport up to 64GB of HBM2e memory, which will give it quick access to very large datasets.
Updated Intel has said its first discrete Arc desktop GPUs will, as planned, go on sale this month. But only in China.
The x86 giant's foray into discrete graphics processors has been difficult. Intel has baked 2D and 3D acceleration into its chipsets for years but watched as AMD and Nvidia swept the market with more powerful discrete GPU cards.
Intel announced it would offer discrete GPUs of its own in 2018 and promised shipments would start in 2020. But it was not until 2021 that Intel launched the Arc brand for its GPU efforts and promised discrete graphics silicon for desktops and laptops would appear in Q1 2022.
Analysis For all the pomp and circumstance surrounding Apple's move to homegrown silicon for Macs, the tech giant has admitted that the new M2 chip isn't quite the slam dunk that its predecessor was when compared to the latest from Apple's former CPU supplier, Intel.
During its WWDC 2022 keynote Monday, Apple focused its high-level sales pitch for the M2 on claims that the chip is much more power efficient than Intel's latest laptop CPUs. But while doing so, the iPhone maker admitted that Intel has it beat, at least for now, when it comes to CPU performance.
Apple laid this out clearly during the presentation when Johny Srouji, Apple's senior vice president of hardware technologies, said the M2's eight-core CPU will provide 87 percent of the peak performance of Intel's 12-core Core i7-1260P while using just a quarter of the rival chip's power.
Intel's PC chip division is the latest team caught in the current tide of economic uncertainty, as the company freezes hiring in the group.
In an internal memo obtained by Reuters, Intel told employees all hiring and job requisitions in the client computing group were on hold for at least two weeks. During that time, the chipmaker will reportedly be reevaluating its priorities with "increased focus and prioritization in our spending [to] help us weather macroeconomic uncertainty," Intel said.
The client computing group, which designs end-user hardware, is Intel's largest by sales, having generated $9.3 billion of the $18.4 billion Intel made last quarter. Despite its place at the top, the CCG's Q1 takings were still down 13 percent compared to the same time in 2021. It was also the only Intel division to lose money compared to Q1 2021, another potential reason for the hiring freeze in the sector.
A California District Court judge has dismissed a proposed class action complaint against Apple for allegedly selling iPhones and iPads containing Arm-based chips with known flaws.
The lawsuit was initially filed on January 8, 2018, six days after The Register revealed the Intel CPU architecture vulnerabilities that would later come to be known as Meltdown and Spectre and would affect Arm and AMD chips, among others, to varying degrees.
Amended in June, 2018 the complaint [PDF] charges that the Arm-based Apple processors in Cupertino's devices at the time suffered from a design defect that exposed sensitive data and that customers "paid more for their iDevices than they were worth because Apple knowingly omitted the defect."
Patch Tuesday Microsoft claims to have finally fixed the Follina zero-day flaw in Windows as part of its June Patch Tuesday batch, which included security updates to address 55 vulnerabilities.
Follina, eventually acknowledged by Redmond in a security advisory last month, is the most significant of the bunch as it has already been exploited in the wild.
Criminals and snoops can abuse the remote code execution (RCE) bug, tracked as CVE-2022-30190, by crafting a file, such as a Word document, so that when opened it calls out to the Microsoft Windows Support Diagnostic Tool, which is then exploited to run malicious code, such spyware and ransomware. Disabling macros in, say, Word won't stop this from happening.
Intel is reportedly set to receive €6.8 billion ($7.3 billion) in subsidies for a massive chip manufacturing campus it's planning in Germany, and the x86 giant apparently won't have to worry about foundry rival TSMC setting up shop anywhere nearby for the time being.
The German subsidies for Intel's planned fab site in Magdeburg was disclosed last week by Martin Kröber, the city's representative in the Bundestag, according to local media. The federal government has already allocated €2.7 billion in its 2022 budget [PDF] for the project, according to Kröber.
Germany's Deutsche Presse-Agentur said the government is discussing the possibility of subsidies for other projects in the microelectronics industry.
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